(A + B + C + D + E + F) * G * H + J + K = Rapid Sampling Price

Composition of scraper system contains printing head, scraper beam and drive part, etc

Solder bead or ball formation during reflow or wave soldering is the result of uneven solder particle melt due to an oxide layer or un-wettable surfaces

DFM is the process of designing parts, components or products for ease of manufacturing with an end goal of making a better product at a lower cost