Views: 56 Author: Site Editor Publish Time: 2020-10-16 Origin: Site
In SMT assembly process, 70% of the defects come from solder paste printing problems. If solder paste printing problems can be found before reflow soldering, the yield of SMT process can be greatly improved. At the end of September, Onlitex introduced a new SPI inspection machine, which greatly improved our production process level and made us more confident to cope with the increasingly complex electronic product production process.