Wave Soldering

Definition 

As its name depicted, wave soldering is used to combine PCB and parts through a liquid “wave” formed as a result of motor agitation and the liquid is actually dissolved tin. It is carried out in wave soldering machine. The image below demonstrates a sample wave soldering machine.

Soldering Process 

Wave soldering process is composed by four steps: flux spraying, pre-heating, wave soldering and cooling. 

Step one: Flux Spraying. Cleanliness of metal surface is the basic element ensuring soldering performance, depending on functions of solder flux. Solder flux plays a crucial role in smooth implementation of soldering.

Step two: Pre-heating. In a pallet along a chain similar to conveyor belt, PCBs travel through a heat tunnel to carry out pre-heating and activate flux.

Step three: Wave Soldering. As temperature constantly rises, solder paste becomes liquid with a wave formed from whose edge boards will travel above and components can be solidly bonded on boards.

Step four: Cooling. Wave soldering profile conforms to a temperature curve. As temperature reaches the peak in wave soldering stage, its reduction comes, which is called a cooling zone. After being cooled to room temperature, board will be successfully assembled.

Application Field 

Wave soldering can be accepted by THT (Through-hole Technology), DIP (dual-in-line packaging) assembly and SMT (Surface Mount Technology).